In the field of Silicon Photonics, a challenge is the exceedingly fine alignment required to couple inputs and outputs. PI’s new F-131 Modular XYZ Photonic Alignment System provides an excellent foundation for developing, studying and pursuing manufacturing and testing of photonic components.
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Cost Effective, Modular XYZ Photonic Alignment
Submicron Features and Rising Quantities Require Automated, Fast Alignment Procedures
Parallelism in Photonics Alignment Automation: Key to Economic Test and Packaging
Compared to the devices typical of the telecom revolution of two decades ago, today’s typical Silicon Photonics (SiP) devices present more channels, smaller form factors, and exponentially higher production quantities.
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