Laser ablation of engineered ceramics surfaces, such as silicon or sapphire, requires a narrow depth of focus to ensure a small focus point that leads to an accurate control of material removal with minimized damage. The laser spot defines the fluence, i.e., the energy delivered per unit area, (the energy delivered per unit area) and its regulation is needed to control the ablation threshold. When material is removed, the distance between the surface being processed and the current focal point change. With the V-308, it is possible to control exactly how deep in the material the process takes place by adjusting the focal point. In addition, the processing efficiency and the quality of the sidewalls within the features can be optimized.